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Micro BGA

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable for socket mounting.

Description

BGA ICs assembled on a PCB The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) on which it is placed. In a BGA the pins are replaced by pads on the bottom of the package, each initially with a tiny ball of solder stuck to it. These solder spheres can be placed manually or by automated equipment, and are held in place with a tacky flux. The device is placed on a PCB with copper pads in a pattern that matches the solder balls. The assembly is then heated, either in a reflow oven or by an infrared heater, melting the balls. Surface tension causes the molten solder to hold the package in alignment with the circuit board, at the correct separation distance, while the solder cools and solidifies, forming soldered connections between the device and the PCB.

Schematic

A schematic, or schematic diagram, is a representation of the elements of a system using abstract, graphic symbols rather than realistic pictures. A schematic usually omits all details that are not relevant to the information the schematic is intended to convey, and may add unrealistic elements that aid comprehension. For example, a subway map intended for riders may represent a subway station with a dot; the dot doesn't resemble the actual station at all but gives the viewer information without unnecessary visual clutter. A schematic diagram of a chemical process uses symbols to represent the vessels, piping, valves, pumps, and other equipment of the system, emphasizing their interconnection paths and suppressing physical details. In an electronic circuit diagram, the layout of the symbols may not resemble the layout in the physical circuit. In the schematic diagram, the symbolic elements are arranged to be more easily interpreted by the viewer.

Electrical and electronic industry

In electrical and electronic industry, a schematic diagram is often used to describe the design of equipment. Schematic diagrams are often used for the maintenance and repair of electronic and electromechanical systems. Original schematics were done by hand, using standardized templates or pre-printed adhesive symbols, but today Electrical CAD software is often used. The circuit diagram for a 4 bit TTL counter, a type of state machine In electronic design automation, until the 1980s schematics were virtually the only formal representation for circuits. More recently, with the progress of computer technology, other representations were introduced and specialized computer languages were developed, since with the explosive growth of the complexity of electronic circuits, traditional schematics are becoming less practical. For example, hardware description languages are indispensable for modern digital circuit design. Schematics for electronic circuits are prepared by designers using EDA (Electronic Design Automation) tools called schematic capture tools or schematic entry tools. These tools go beyond simple drawing of devices and connections. Usually they are integrated into the whole IC design flow and linked to other EDA tools for verification and simulation of the circuit under design. In electric power systems design, a schematic drawing called a one-line diagram is frequently used to represent substations, distribution systems or even whole electrical power grids. These diagrams simplify and compress the details that would be repeated on each phase of a three-phase system, showing only one element instead of three. Electrical diagrams for switchgear often have common device functions designate by standard function numbers.

Chip Level Service

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable for socket mounting.

Description

BGA ICs assembled on a PCB The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) on which it is placed. In a BGA the pins are replaced by pads on the bottom of the package, each initially with a tiny ball of solder stuck to it. These solder spheres can be placed manually or by automated equipment, and are held in place with a tacky flux. The device is placed on a PCB with copper pads in a pattern that matches the solder balls. The assembly is then heated, either in a reflow oven or by an infrared heater, melting the balls. Surface tension causes the molten solder to hold the package in alignment with the circuit board, at the correct separation distance, while the solder cools and solidifies, forming soldered connections between the device and the PCB.

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